Description
KY-8030 is a process optimization tool built with world-class Koh Young quality components and engineering. It’s the perfect complement to your manufacturing line, where precise, accurate, repeatable results cannot be compromised. The KY-8030 is an in-line, fully automated SPI system that uses patented Koh Young shadow-free inspection technology and software to deliver 100% 3D inspection of solder paste. Superb Performance and Value in Automated 3D SPI Medium-volume users will appreciate KY-8030’s rugged dependability and all the benefits of in-line 3D SPI but at a lower initial investment. It delivers superior value to the customer because it will out-perform costly competitive systems that don’t offer true 3D SPI.
| Model | Koh Young 3D SPI KY8080 |
| Inspection Range | |
| Metrology Capability | Volume, Area, Height, Offset, Bridging and Shape Deformity |
| Types of Defects | Insufficient/Excessive/Missing Paste, Bridging, Shape Deformity and Paste Offset |
| Measurement Principle | 3D Shadow Free Moiré |
| Camera Technology | |
| Camera | 2MPix |
| XY Pixel Resolution: 20 µm 0.79 mils | |
| Z Resolution: 0.37 µm 0.015 mils | |
| Inspection Speed
at 20 um |
Shadow Free Mode:15.0 cm2/sec 2.33 sq. inch/sec |
| High Speed Mode: 19.7 cm2/sec 3.05 sq. inch/sec | |
| Volume Repeatability | < 1% at 3sigma (on a KY Calibration Target) |
| < 3% at 3sigma (on a PCB) | |
| Height Accuracy | 2mm |
| Gage R&R | < 10 % at 6Sigma (± 50 tolerance) |
| Max. PCB Warp | ± 3.5 mm |
| Max. Paste Height | 400um 15.75 mils |
| Min. Paste Deposit Size at 20um | Rectangle: 150um 5.91 mils |
| Circle Min: 200um 7.87 mils | |
| Distance between Paste Deposit | 100 mm (at 150 mm paste height) 3.94 mils (at 5.91 mils paste height) |
| PCB Handling | |
| Conveyor Width Adjustment | Automatic |
| Conveyor Fix Type | Front/Rear Fixed (Factory Setting) |
| Conveyor Height | 970 ~ 870 mm 38.19 ~ 34.25 inch |
| System & Installation requirements | |
| Supply | Electrical 200 ~ 240VAC, 50/60 Hz Single phase |
| Air: 5 Kgf/cm2 | |
| Operating System | Windows XP Professiona |
| S/W | |
| Statistical Analysis Tool | SPC Plus |
| Inspection Program Generation | Import GERBER Data (274X, 274D) |
| Options | Zoom Head (15, 20, 30 mm Autozoom) |
| Off-line SPC & Defect Review Station | |
| Off-line Programming Station ODB++ File Conversion | |
| Barcode Reader (1D/2D) HDD Raid 1 (Mirrored) | |
| Certified Calibration Target UPS | |
| Above specifications are subject to change whithout notice. | |
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