Description
In electronics manufacturing, the SIPLACE SX, the world’s first placement solution specifically developed to meet the challenges of modern high-mix electronics manufacturing, is leading the industry to new heights. Its introduction enables companies to achieve efficient and flexible production in high-mix, low-volume production environments.
1. Highly Flexible, Adaptable to Diverse Production Needs
Based on a modular platform design, the SIPLACE SX features hardware, software, and a user interface that work in tandem to easily handle a wide variety of products, components, and circuit boards. Fast line changeovers and new product introductions are no longer a challenge. It features a variety of scalable placement heads, each with its own unique advantages:
SIPLACE MultiStar: The world’s only placement head capable of switching between collect-and-place, pick-and-place, and mixed modes on demand, offering unparalleled flexibility and accommodating components ranging from 01005 to 50 mm x 40 mm, with a height of up to 11.5 mm. The SIPLACE TwinStar: A master at handling large, specialized components, it can place components as small as 45 mm x 55 mm and up to 25 mm in height with an accuracy of up to 22 μm.
The SIPLACE SpeedStar: A synonym for speed and precision, it can place components as small as 0201 (metric) and as large as 8.2 mm x 8.2 mm at a speed of 48,000 cph, making it the world’s fastest placement head.
These three placement heads, combined, can handle PCBs as small as 450 mm x 275 mm and as large as 1,525 mm x 560 mm, completing diverse placement tasks while avoiding frequent downtime and adjustments associated with line changeovers. This truly ensures “products move first, production lines remain.”
2. High Precision and High Automation Ensure Production Stability
Advanced Imaging for Precise Placement: A built-in high-speed image processing system generates 3D images to accurately identify pads, detect THT pin damage, and check the placement status of snap-in components. Dynamic image recognition compensates for minor deviations in component position and shape, ensuring placement accuracy. For example, the SIPLACE TwinStar achieves placement accuracy of up to 22μm @ 3 sigma.
Flexible Placement Pressure: The placement pressure is adjustable from non-contact to 0.5N–100N, ensuring gentle contact with sensitive LEDs while maintaining a secure fit for heavy connectors.
Intelligent Feeding and Tray Changing: The automated feeding and tray changing system supports non-stop operation. The new SIPLACE Xi intelligent feeder utilizes contactless power and data transmission for high precision, reliability, and low maintenance. It is compatible with a variety of feeding methods, including feeders up to 80×8 mm, JEDEC trays, and dispensing feeders, ensuring worry-free material feeding. Enhanced Placement of Odd-Form Parts: The Odd-Form Parts Function Package enhances identification and placement capabilities, intelligently matching optimal speeds, alleviating cycle bottlenecks, and reducing manual intervention.
Data Integration and Smart Factory Connectivity: Rich data output via open interfaces such as ASMPT OIB and IPC CFX facilitates integration with MES and traceability systems, building an intelligent, transparent, and efficient production system.
3. Scalable Design to Address Capacity Fluctuations
The SIPLACE SX’s unique interchangeable cantilever enables “on-demand expansion.” In less than 30 minutes, operators can install a second cantilever (doubling capacity) or relocate a cantilever to another line. As order volumes fluctuate, companies can flexibly increase or decrease placement capacity, avoiding costly line reconfigurations and responding to market changes cost-effectively. SIPSMT
