Description
The SIPLACE TX is the ideal equipment for the smart factory. With a compact footprint of just 1m x 2.23m, it delivers exceptional productivity of up to 96,000 cph. The new CP20 placement head and SIPLACE Xi intelligent feeder combine to ensure precise loading.
Its extensive head portfolio includes the SIPLACE SpeedStar, which places components up to 8.2 mm x 8.2 mm at 48,000 cph; the SIPLACE TwinStar, which can handle large components up to 200 mm x 125 mm; and the SIPLACE MultiStar, which offers three placement modes: collect, pick, and mix. These three heads work together to cover component sizes ranging from 0.12 mm x 0.12 mm to 200 mm x 125 mm.
The intelligent imaging system independently images each component, accurately inspecting PCBs, odd-shaped components, and even crack detection. The flexible track design, with dual-track and long-track options, accommodates a wide range of PCB transport. Furthermore, non-contact placement and a placement force as low as 0.5N protect sensitive components. Through the IIoT interface, it seamlessly integrates into production lines and factory systems, providing an efficient and intelligent solution for electronics production.SIPSMT
